群联
群联SSD
大鑫浪代理的PHISON群联专精于闪存技术，超过20年的闪存主控IC设计经验，全球超过2000项闪存相关专利，包含关联的闪存管理技术，丰富且广泛的行业应用专业技术从，包含崁入式，企业级，终端个人计算机，及移动装置应用PATA, SATA, PCIe NVMe, USB, SD, eMMC, UFS。
| 群联PCIe 嵌入式解決方案主控規格 | ||||
| 型号 | PS5012-E12DI | PS5018-E18DI | PS5013-E13TI | PS5021-E21TI |
| 接口 | Gen 3x4 NVMe | Gen 4x4 NVMe | Gen 3x4 NVMe | Gen 4x4 NVMe |
| 制程 | 28nm | 12nm | 28nm | 12 nm |
| 量产时程 | MP | MP: Q2’22 | MP | MP: Q2’22 |
| DRAM | DDR4 | DDR4 | N/A | N/A |
| 通道 | 8 | 8 | 4 | 4 |
| 效能1 | 3400/3100 MB/s 650K/650K IOPS |
7200/6500 MB/s 750K/1000K IOPS |
2500/1900 MB/s 270K/420K IOPS |
3600/3000 MB/s 600K/310K IOPS |
| ECC机制 | LDPC Gen 3 + RAID | LDPC Gen 4 + RAID | LDPC Gen 4 + RAID | LDPC Gen 4 + RAID |
| CE数 | 64CE (Up to 16TB) | 32CE (Up to 4TB) | 16CE (Up to 2TB) | 16CE (Up to 2TB) |
| 闪存 | 64L/96L/112L 3D TLC | 112L 3D TLC | 64L/96L/112L 3D TLC | 112L/176L 3D TLC |
| 安全加密 | TCG OPAL | TCG OPAL | TCG OPAL | TCG OPAL |
| 宽温 | Support | Support | Support | Support |
| 产品型态 | U.2/ M.2 2280/M.2 22110 | M.2 2280 | M.2 2280/2242/CFX/BGA SSD | M.2 2280/ 2230/ BGA SSD |
| 群联SATA 嵌入式解決方案主控規格 | |||
| 型号 | PS3111-S11T | PS3112-S12DI | PS3117-S17TI |
| 接口 | SATA III | SATA III | SATA III |
| 制程 | 40nm | 28nm | 28nm |
| 量产时程 | MP | MP | MP |
| DRAM | N/A | DDR4/DDR3L | N/A |
| 通道 | 2 | 8 | 2 |
| 效能1 | 550/500 MB/s 90K/85K IOPS |
550/530 MB/s 98K/90K IOPS |
550/510 MB/s 95K/86K IOPS |
| ECC机制 | LDPC + RAID | LDPC + RAID | LDPC + RAID |
| CE数 | 16 (Up to 1TB) | 32 (Up to 16TB) | 16 (Up to 2TB) |
| 闪存 | 64L/96L/112L 3D TLC 2D MLC/ SLC |
64L/96L/112L 3D TLC | 112L 3D TLC |
| 安全加密 | N/A | TCG OPAL | TCG OPAL |
| 宽温 | Support | Support | Support |
| 产品型态 | 2.5”/M.2 2280/M.2 2242/mSATA/BGA SSD | 2.5”/M.2 2280/M.2 2242 | 2.5”/M.2 2280/M.2 2242/mSATA/CFast |
| 群联PCIe SSD 嵌入式产品定位 | ||||
| 标准型 | 高端型 | |||
| 主控 | PS5013-E13TI | PS5021-E21TI | PS5012-E12DI | PS5018-E18DI |
| 接口 | PCIe Gen3 x 4 | PCIe Gen4 x 4 | PCIe Gen3 x 4 | PCIe Gen4 x 4 |
| 容量 | 128GB – 2048GB | 256-2048GB | 240GB – 15360GB | 480-3840GB |
| 内存/无内存 DRAM | DRAM-less | DRAM-less | DDR4 | DDR4 |
| 连续读/写效能 | Burst Seq. 2500/1900 MB/s | Burst Seq. 3600/3000 MB/s | Burst Seq. 3200/3000 MB/s1 Sustained Seq.3200/1000 MB/s |
Burst Seq. 7200/6500 MB/s1 Seq. w/o SLC cache : 6800/2400 MB/s |
| 4K 随机读/写效能 | Burst Ran. 270K/420K IOPS | Burst Ran. 600K/310K IOPS | Burst Ran. 700K/600K IOPS1 Sustained Ran. 460K/30K IOPS |
Burst Ran. 750K/1000K IOPS1 Ran. w/o SLC cache 600K/300K IOPS |
| 平均功耗 | Read: 4.0W Write: 3.5W |
Read: 4.6W Write: 4.6W |
Read: 9.0W Write: 6.6W |
Read: 11.0W Write: 11.0W |
| 可靠度 (MTBF) | > 2,000,000 | > 1,500,000 | > 1,500,000 | > 1,500,000 |
| 可靠度 (TBW) | > 2,400 (base on 2048GB) | > 1,600 (base on 2048GB) | > 12,000 (base on 7680GB) | > 5,000 (base on 3840GB) |
| 安全加密 | TCG OPAL | TCG OPAL | TCG OPAL | TCG OPAL |
| HW PLP Circuit | NA | NA | Support | NA |
| 产品型态 | M.2 2242 / M.2 2280 /CFXTM / BGA SSD |
M.2 2280/ 2230/ BGA SSD | M.2 2280 / M.2 22110 / U.2 | M.2 2280 |
| 群联PCIe Gen4 SSD 嵌入式解决方案 | ||
| 型号 | E18DI M.2 2280 |
E21TI M.2 2280 |
| 接口 | Gen 4x4 NVMe1.4 | Gen 4x4 NVMe1.4 |
| 内存/无内存DRAM | DDR4 | DDR4-less |
| 闪存组合架构 | X4 3D TLC NAND Flash Double side |
X4 3D TLC NAND Flash Double side |
| 主要特点 | 高阶 PCIe Gen4 SSD 超高密度 PCIe SSD，适用于数据记录或边缘计算存储 |
具有 Gen4 高性能和低消耗，适合读取或入门级混合工作负载系统 的高阶DRAM-less SSD |
| 容量 | 480GB ~ 3840GB | 256GB ~ 2048GB |
| 效能 | Seq. with SLC cache : 7200/6500 MB/s4 Seq. without SLC cache : 6800/2400 MB/s5 |
Seq. with SLC cache : 3600/3000 MB/s4 Seq. without SLC cache : 3200/1500 MB/s5 |
| 4KB随机效能 | Ran. with SLC cache : 750K/1000K IOPS4 Ran. without SLC cache : 600K/300K IOPS5 |
Ran. with SLC cache : 600K/310K IOPS4 Ran. without SLC cache : 350K/180K IOPS5 |
| 热传感应 | Yes | Yes |
| 安全加密保护 | TCG OPAL | TCG OPAL |
| HW PLP Circuit | X | X |
| 运作温度 | 0~70℃ to -40~85℃ | 0~70℃ to -40~85℃ |
| 群联PCIe Gen3 SSD 嵌入式解决方案 (1/2) | |||
| 型号 | E12DI U.2 |
E12DI M.2 22110 |
E12DI M.2 2280 |
| 接口 | Gen3x4 NVMe1.3 | Gen3x4 NVMe1.3 | Gen3x4 NVMe1.3 |
| 内存/无内存DRAM | DDR4 | DDR4 | DDR4 |
| 闪存组合架构 | X8/16 NAND Flash | X8 3D TLC NAND Flash | X4 3D TLC NAND Flash |
| 主要特点 | 杰出的稳定效能、低延迟 搭载断电保护机制,于意外断电期间保护关键数据 |
超大容量 PCIe SSD, 适用于端点运算装置 | 先进且高阶的 PCIe 固态硬盘 适用于混合型工作负载装置的M.2模块 |
| 容量 | 240GB ~ 15360GB | 3840GB | 240GB ~ 1920GB |
| 效能 | Burst Seq. 3200/3000 MB/s4 Sustained Seq.3200/1000 MB/s (Default) |
Burst Seq. 3200/2800 MB/s Sustained Seq. 3200/850 MB/s |
Burst Seq. 3200/3000 MB/s Sustained Seq.3000/1000 MB/s |
| 4KB随机效能 | Burst Ran. 700K/600K IOPS4 Sustained Ran. 400K/30K IOPS (Default) |
Burst Ran. 680K/600K IOPS Sustained Ran. 200K/20K IOPS |
Burst Ran. 490K/500K IOPS Sustained Ran. 200K/20K IOPS |
| 热传感应 | Yes | Yes | Yes |
| 安全加密保护 | TCG OPAL | TCG OPAL | TCG OPAL |
| HW PLP Circuit | Support | X | X |
| 运作温度 | 0~70℃ ~ -40~85℃ | 0~70℃ to -40~85℃ | 0~70℃ to -40~85℃ |
| 群联PCIe Gen3 SSD 嵌入式解决方案 (2/2) | |||
| 型号 | E13TI M.2 2280 |
E13TI M.2 2242 |
E13TI M.2 2242 |
| 产品型态 | M.2 2280-S2-M | M.2 2242-D2-M | M.2 2242-D2-B-M |
| 接口 | Gen3x4 NVMe1.3 | Gen3x4 NVMe1.3 | Gen3x2 NVMe1.3 |
| 内存/无内存DRAM | DRAM-Less | DRAM-Less | DRAM-Less |
| 闪存组合架构 | X4 3D TLC NAND Flash Single side |
X4 3D TLC NAND Flash Double side |
X4 3D TLC NAND Flash Double side |
| 主要特点 | 用于嵌入式系统的主流无内存 PCIe SSD 适用于读取密集型的驱动装置 竞争力与经济效益兼具的全方位固态硬盘 |
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| 容量 | 128GB ~ 2048GB | 128GB ~ 2048GB | 128GB ~ 2048GB |
| 效能 | 2500/1900 MB/s | 2500/1900 MB/s | 1750/1600 MB/s |
| 热传感应 | Yes | Yes | Yes |
| 安全加密保护 | TCG OPAL | TCG OPAL | TCG OPAL |
| 运作温度 | 0~70℃ to -40~85℃ | 0~70℃ to -40~85℃ | 0~70℃ to -40~85℃ |
| 群联SATA SSD 嵌入式产品定位 | |||
| 标准型 | 高端型 | ||
| 主控 | PS3111-S11T | PS3117-S17TI | PS3112-S12DI |
| 接口 | SATA Gen III | SATA Gen III | SATA Gen III |
| 容量 | 4GB – 1024GB | 64GB – 2048GB | 120GB – 15360GB |
| 内存/无内存 DRAM | DRAM-less | DRAM-less | DDR4/DDR3L |
| 连续读/写效能 | 550/500 MB/s | 550/510 MB/s | 550/530 MB/s |
| 4K 随机读/写效能 | Burst Ran. 79K/89K IOPS1 | Burst Ran. 95K/86K IOPS | Burst Ran. 98K/90K IOPS1 Sustained Ran. 98K/20K IOPS |
| 平均功耗 | Read: 2.0W Write: 2.1W |
Read: 1.6W Write: 1.8W |
Read: 4.0W Write: 5.0W |
| 可靠度 (MTBF) | > 2,000,000 | > 2,500,000 | > 1,500,000 |
| 可靠度 (TBW) | > 800 (base on 1024GB) | > 2,900 (based on 2048GB) | > 12,000 (base on 7680GB) |
| 安全加密 | NA | TCG OPAL | TCG OPAL |
| HW PLP Circuit | NA | NA | Support |
| 产品型态 | mSATA/ mSATA-mini / Cfast / M.2 series / BGA SSD / 2.5” |
2.5” / M.2 2280 / M.2 2242 / mSATA / CFast | M.2 2280 / M.2 2242 / 2.5” |
| 群联SATA SSD 嵌入式解决方案 (1/3) | ||||
| 型号 | S12DI 2.5” |
S12DI M.2 2280 |
S12DI M.2 2280 |
S12DI M.2 2242 |
| 内存/无内存DRAM | DDR4/DDR3L | DDR4 | DDR4 | DDR4 |
| 闪存组合架构 | X4/8/16 NAND Flash 3D TLC |
X2/4 NAND Flash 3D TLC |
X2 NAND Flash 3D TLC |
X1 NAND Flash 3D TLC |
| 主要特点 | 高密度和稳定的性能，用于监视或 边缘计算的数据记录 |
优化的硬件与固件提供可靠的录像并 防止掉格 |
具备PLP断电保护机制的M.2模块, 于意外断电时保护关键数据与数据 |
小巧的模块提供断电保护机制 适用于开机装置 |
| 容量 | 120GB ~ 15360GB | 120GB ~ 1920GB | 240GB ~ 960GB | 120GB ~ 480GB |
| 效能 | Max 550/530 MB/s | Max 550/530 MB/s | Max 550/530 MB/s | Max 550/490 MB/s |
| 热传感应 | Yes | Yes | Yes | Yes |
| HW PLP circuit | Support | X | Support | Support |
| GPIO WP/QE | Support | Support | X | X |
| 安全加密保护 | TCG OPAL | TCG OPAL | TCG OPAL | TCG OPAL |
| 运作温度 | 0~70℃ to -40~85℃ | 0~70℃ to -40~85℃ | 0~70℃ to -40~85℃ | 0~70℃ to -40~85℃ |
| 群联SATA SSD 嵌入式解决方案 (2/3) | ||||
| 型号 | S17TI 2.5” |
S17TI M.2 2280 |
S17TI M.2 2242 |
S17TI mSATA |
| 内存/无内存DRAM | DRAM-Less | DRAM-Less | DRAM-Less | DRAM-Less |
| 闪存组合架构 | X1/2/4 NAND Flash 3D TLC |
X1/2/4 NAND Flash 3D TLC |
X1/2 NAND Flash 3D TLC |
X1/2/4 NAND Flash 3D TLC |
| 主要特点 | 主流且具成本效益的无内存固态硬盘解决方案, 专为嵌入式装置而设计 具备竞争力的瞬间性能与低功耗. 可支持最新世代的闪存 适用于IPC启动设备和读取密集型设备, 具备AES/OPAL功能 |
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| 容量 | 64GB-2048GB | 64GB ~ 2048GB | 64GB ~ 1024GB | 64GB ~ 2048GB |
| 效能 | Max 550/510 MB/s | Max 550/510 MB/s | Max 550/510 MB/s | Max 550/510 MB/s |
| 热传感应 | Yes (External Sensor) | Yes (External Sensor) | Yes (Internal Sensor) | Yes (Internal Sensor) |
| HW PLP circuit | X | X | X | X |
| Data WP/Erase | Support | Support | Support | Support |
| 安全加密保护 | TCG OPAL | TCG OPAL | TCG OPAL | TCG OPAL |
| 运作温度 | 0~70℃ to -40~85℃ | 0~70℃ to -40~85℃ | 0~70℃ to -40~85℃ | 0~70℃ to -40~85℃ |
| 群联SATA SSD 嵌入式解决方案 (3/3) | ||
| 型号 | S11T 2.5” / mSATA / M.2 2280 |
S11T M.2 2242 |
| 内存/无内存DRAM | DRAM-Less | DRAM-Less |
| 闪存组合架构 | X4 NAND Flash 2D MLC/SLC/3D TLC |
X2 NAND Flash 2D MLC/SLC/3D TLC |
| 主要特点 | 2D至3D TLC皆可搭配,具备竞争力的瞬间性能 与低功耗 适用于传统型开机装置 |
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| 容量 | 4GB ~ 1024GB | 4GB ~ 512GB |
| 效能 | Max 550/500 MB/s | Max 550/500 MB/s |
| 热传感应 | Yes | Yes |
| HW PLP circuit | X | X |
| Data WP/Erase | Support | X |
| 安全加密保护 | X | X |
| 运作温度 | ±40~85℃ | ±40~85℃ |
| 群联CFast (SATA) / CFX (PCIe) 嵌入式解决方案 | |||
| 型号 | S11T CFast |
S17TI CFast |
E13TI CFXTM |
| 接口 | SATA III and backward, 2CH | SATA III and backward, 2CH | Gen3x2 NVMe, 4CH |
| 尺寸 | 42.8 x 36.4 x 3.3 mm | 42.8 x 36.4 x 3.3 mm | 38.5 x 29.6 x 3.8mm (Type B) |
| 闪存组合架构 | X1/2 NAND Flash 2D MLC/SLC/3D TLC |
X2 NAND Flash 3D TLC |
X4 NAND Flash 3D TLC |
| 主要特点 | 可拆卸式及低功耗的SATA存储装置 | 具有低功耗和安全功能的可拆卸式 SATA 存儲 |
具竞争力的全方位固态硬盘, 适用于开机装置 与混合式工作存储 |
| 容量 | 8GB ~ 512GB | 64GB ~ 512GB | 128GB ~ 1024GB |
| 效能 | Max 550/490 MB/s | Max 550/500 MB/s | Max 1700/1600 MB/s |
| 热传感应3 | Yes | Yes (Internal Sensor) | Yes |
| 安全加密保护 | NA | TCG OPAL | TCG OPAL |
| 运作温度4 | ±40~85℃ | 0~70℃ to -40~85℃ | 0~70℃ to -40~85℃ |
PHISON群联代理商，欢迎咨询，还有更多精彩群联闪存存储分享《群联PCIe》《群联SATA/PATA》
