| PS8317 UFS 2.2 系列规格与功能特性 | |||
| 容量 | 64GB | 128GB | 256GB |
| 接口 | HS-G3x2 UFS 2.2 | HS-G3x2 UFS 2.2 | HS-G3x2 UFS 2.2 |
| 封装 | 153 Ball (11.5x13x1.0mm) |
153 Ball (11.5x13x1.0mm) |
153 Ball (11.5x13x1.0mm) |
| 闪存 | 176 Layers | 176 Layers | 176 Layers |
| 闪存类型 | TLC | TLC | TLC |
| 效能 连续读取/写入(MB/s) |
Up to R800/W400 | Up to R1000/W800 | Up to R1000/W950 |
| 加快写入装置尺寸 | 2GB | 4GB | 8GB |
| 主机性能提升器 | HPB2.0 | HPB2.0 | HPB2.0 |
| 运作温度Grade2/Grade3/Industrial | ±40~105℃/±40~85℃ | ±40~105℃/±40~85℃ | ±40~105℃/±40~85℃ |
| 核心电压 (VCC) | 3.3V | 3.3V | 3.3V |
| I/O 电压 (VCCQ) | 1.8V | 1.8V | 1.8V |
| 可靠度 W/E Endurance |
TLC：≥ 3K | TLC：≥ 3K | TLC：≥ 3K |
| 资料保存期间 | 1year @ Life end 10years @ initial |
1year @ Life end 10years @ initial |
1year @ Life end 10years @ initial |
| PS8317 UFS 3.1 系列规格与功能特性 | |||
| 容量 | 64GB | 128GB | 256GB |
| 接口 | HS-G4x2 UFS 3.1 | HS-G4x2 UFS 3.1 | HS-G4x2 UFS 3.1 |
| 封装 | 153 Ball (11.5x13x1.0mm) |
153 Ball (11.5x13x1.0mm) |
153 Ball (11.5x13x1.0mm) |
| 闪存 | 176 Layers | 176 Layers | 176 Layers |
| 闪存类型 | TLC | TLC | TLC |
| 效能 连续读取/写入(MB/s) |
Up to R800/W420 | Up to R1500/W800 | Up to R1650/W1100 |
| 加快写入装置尺寸 | 2GB | 4GB | 8GB |
| 主机性能提升器 | HPB2.0 | HPB2.0 | HPB2.0 |
| 运作温度Grade2/Grade3/Industrial | ±40~105℃/±40~85℃ | ±40~105℃/±40~85℃ | ±40~105℃/±40~85℃ |
| 核心电压 (VCC) | 2.5V | 2.5V | 2.5V |
| I/O 电压 (VCCQ) | 1.2V | 1.2V | 1.2V |
| 可靠度 W/E Endurance |
TLC：≥ 3K | TLC：≥ 3K | TLC：≥ 3K |
| 资料保存期间 | 1year @ Life end 10years @ initial |
1year @ Life end 10years @ initial |
1year @ Life end 10years @ initial |
| 嵌入式商規 UFS 2.2 与 3.1 规格比较 | ||
| UFS 2.2 | UFS 3.1 | |
| 主控 | PS8317 | PS8318 |
| 接口 | HS-G3x2 UFS 2.2 | HS-G3x2 UFS 3.1 |
| 闪存 | Micron 176L, 3D TLC, 512Gbit | Micron 176L, 3D TLC, 512Gbit |
| 容量 (GB) | 64/128/256GB | 128/256/512GB |
| NAND 通道, 最大传输速率 | 2ch, 800MT/s | 2ch, up 1600MT/s or 4ch, up to 800MT/s |
| 连续读/写效能(up to) | 1040/910 MB/s | 1900/1425 MB/s |
| 4K随机读/写效能(up to) | 120K/175K IOPS | 200K/235K IOPS |
| 有效功率 (RMS) | TBD | TBD |
| 写入加速技术 | Supported | Supported |
| HPB 2.0 | Supported | Supported |
| 封装类型 | BGA-153 | BGA-153 |
| 尺寸 (mm) | 11.5 x 13.0 | 11.5 x 13.0 |
| 运作温度 | ±25°C to 85°C | ±25°C to 85°C |
| 型号 (PartNo.) |
PSUF22H17-B064SS |
PSUF31L18-A128SS PSUF31L18-A256SS PSUF31L18-A512SS |
